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Taiwan Semiconductor Manufacturing Sales

To deliver cutting-edge semiconductor manufacturing solutions that power global innovation by becoming the world's most trusted semiconductor technology partner

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To deliver cutting-edge semiconductor manufacturing solutions that power global innovation by becoming the world's most trusted semiconductor technology partner

Strengths

  • TECHNOLOGY: Industry-leading 3nm process with superior yield rates
  • CAPACITY: Largest dedicated semiconductor foundry capacity globally
  • CUSTOMERS: Strategic partnerships with Apple, NVIDIA, AMD, Qualcomm
  • TALENT: World-class engineering talent and semiconductor expertise
  • FINANCIAL: Strong balance sheet with $43B+ cash reserves

Weaknesses

  • GEOPOLITICAL: Concentrated manufacturing footprint in Taiwan
  • SUPPLY CHAIN: Vulnerable to global materials shortages and disruptions
  • ENTERPRISE: Underdeveloped enterprise customer segment compared to core
  • EXPERTISE: Knowledge gaps in emerging automotive semiconductor needs
  • TALENT: Insufficient sales and solutions engineering for new markets

Opportunities

  • AI: Explosive demand for high-performance compute chips for AI/ML
  • AUTOMOTIVE: Growing semiconductor content in EVs and autonomous cars
  • IOT: Expansion of edge computing and connected device applications
  • GLOBAL: New US and EU chip fabs to diversify manufacturing footprint
  • EXPANSION: Potential to expand high-margin specialty process services

Threats

  • COMPETITION: Intel, Samsung expanding foundry capabilities aggressively
  • GEOPOLITICAL: Taiwan-China tensions creating customer anxiety
  • TECH: Potential slowdown in Moore's Law advancement and scaling limits
  • ECONOMIC: Cyclical industry downturns affecting capacity utilization
  • REGULATORY: Export controls limiting access to key markets

Key Priorities

  • DIVERSIFY: Accelerate global manufacturing footprint expansion
  • AI SPECIALIZATION: Develop dedicated solutions for AI chipmakers
  • ENTERPRISE: Build stronger enterprise sales and solutions teams
  • SUSTAINABLE: Pioneer sustainable semiconductor manufacturing
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To deliver cutting-edge semiconductor manufacturing solutions that power global innovation by becoming the world's most trusted semiconductor technology partner

GLOBAL FOOTPRINT

Accelerate worldwide manufacturing capacity expansion

  • CONSTRUCTION: Accelerate Arizona fab timeline to achieve 75% completion by Q3 2025
  • EUROPE: Finalize site selection and break ground on European facility by Q2-end
  • CAPACITY: Increase global non-Taiwan manufacturing capacity by 18% within 12 months
  • CUSTOMERS: Secure 8+ major customer commitments for new facilities by end of Q3
AI DOMINANCE

Lead the AI chip manufacturing revolution

  • DIVISION: Launch dedicated AI solutions business unit with 150+ specialized staff
  • PROCESS: Develop and qualify AI-optimized 2nm process node with 20% better efficiency
  • CUSTOMERS: Secure 5 new strategic AI chip designer partnerships for future designs
  • REVENUE: Achieve 27% year-over-year growth in AI chip manufacturing revenue
ENTERPRISE REACH

Build robust enterprise customer segment

  • TEAM: Hire and onboard 75+ enterprise-focused solutions engineers by Q2-end
  • PROGRAM: Launch enterprise semiconductor education program reaching 500+ companies
  • PIPELINE: Build $750M pipeline of new enterprise semiconductor opportunities
  • CUSTOMERS: Convert 35 new enterprise customers from specialized industries
GREEN LEADERSHIP

Pioneer sustainable semiconductor manufacturing

  • RENEWABLE: Increase renewable energy usage to 45% of total manufacturing power
  • WATER: Reduce ultra-pure water consumption per wafer by 12% through recycling
  • EMISSIONS: Decrease scope 1 & 2 emissions per wafer by 15% from 2024 baseline
  • CERTIFICATION: Achieve carbon neutrality certification for two manufacturing sites
METRICS
  • Advanced Node Revenue Growth: 22%
  • AI Customer NPS: 75
  • Manufacturing Capacity Utilization: 93%
VALUES
  • Integrity
  • Commitment
  • Innovation
  • Customer Success
  • Environmental Sustainability
Taiwan Semiconductor Manufacturing logo
Align the learnings

Taiwan Semiconductor Manufacturing Sales Retrospective

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To deliver cutting-edge semiconductor manufacturing solutions that power global innovation by becoming the world's most trusted semiconductor technology partner

What Went Well

  • REVENUE: Exceeded Q4 revenue targets by 7.5% driven by AI chip demand
  • MARGINS: Advanced node gross margins improved by 2.3 percentage points
  • CUSTOMERS: Added three new strategic AI chip design customers in Q4
  • CAPACITY: Achieved 92% capacity utilization rate across all facilities
  • INNOVATION: Successfully delivered first 3nm process chips to customers

Not So Well

  • AUTOMOTIVE: Automotive segment growth fell 4% below projections
  • PRICING: Price pressure in mature nodes reduced margins by 1.2 points
  • EXPANSION: Arizona fab construction timeline delayed by 3 months
  • ENTERPRISE: Enterprise customer acquisition missed targets by 15%
  • COSTS: Raw material costs increased 6.7% above forecasted levels

Learnings

  • DIVERSIFICATION: Need for faster geographic manufacturing expansion
  • SPECIALIZATION: AI chip demand requires dedicated capacity planning
  • ENTERPRISE: Sales approach requires more solution-oriented approach
  • TALENT: Critical talent shortage in advanced packaging capabilities
  • FORECASTING: Improved demand forecasting models needed for planning

Action Items

  • ACCELERATE: Fast-track Arizona and European fab construction timelines
  • CREATE: Establish dedicated AI chip manufacturing business unit
  • HIRE: Recruit 200+ semiconductor sales & solutions engineering talent
  • DEVELOP: Build comprehensive AI chip fabrication optimization platform
  • EDUCATE: Launch enterprise customer semiconductor education program
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To deliver cutting-edge semiconductor manufacturing solutions that power global innovation by becoming the world's most trusted semiconductor technology partner

Strengths

  • PROCESS: Optimized fabrication processes for AI chip architectures
  • EXPERTISE: Deep understanding of high-performance computing needs
  • CUSTOMERS: Existing relationships with leading AI chip designers
  • INFRASTRUCTURE: Advanced facilities suitable for AI chip production
  • RESEARCH: Dedicated AI-optimized semiconductor research programs

Weaknesses

  • SOLUTIONS: Limited AI-specific solution engineering capabilities
  • TALENT: Insufficient AI domain expertise in sales organization
  • MARKETING: Underdeveloped AI-specific value proposition messaging
  • CUSTOMIZATION: Limited flexibility for AI-specific customizations
  • TESTING: Inadequate AI workload-specific testing infrastructure

Opportunities

  • SPECIALIZED: Develop AI-optimized process nodes and packaging
  • PARTNERSHIPS: Create strategic alliances with AI software platforms
  • SERVICES: Launch AI chip design optimization consultation services
  • INNOVATION: Pioneer new materials and designs for AI efficiency
  • VERTICAL: Create dedicated AI chip manufacturing business unit

Threats

  • COMPETITION: Rivals developing specialized AI fabrication processes
  • DEMAND: Unpredictable volatility in AI chip demand forecasting
  • SPECIALIZATION: Customer shift to application-specific AI chips
  • INNOVATION: Potential disruption from neuromorphic computing
  • RESOURCES: Competing demands between AI and traditional segments

Key Priorities

  • AI-FIRST: Create dedicated AI chip manufacturing solutions team
  • ECOSYSTEM: Build comprehensive AI partnerships across value chain
  • EXPERTISE: Acquire specialized AI talent and knowledge resources
  • OPTIMIZE: Develop specialized fabrication processes for AI chips